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Published on: May 13, 2020
High-Performance LiNbO3 Domain Wall Memory Devices with Enhanced Selectivity via Optimized Metal-Semiconductor
Haiqing Jiang1, Cuihua Dai1, Bowen Shen1
1School of Microelectronics, Fudan University, Shanghai 200433, China.
Researchers improved lithium niobate (LiNbO3) domain wall random access memory (DWRAM) by adding a titanium interlayer. This significantly boosts current density and device speed for advanced integrated circuits.
Area of Science:
- Materials Science
- Nanotechnology
- Solid State Physics
Background:
- Lithium niobate (LiNbO3) nanodevices show promise for memory computing due to high domain wall currents.
- Suboptimal electrode-LiNbO3 contacts limit current stability in these devices.
Purpose of the Study:
- To enhance domain wall current in LiNbO3 nanodevices by optimizing fabrication processes for domain wall random access memory (DWRAM).
- To investigate the impact of interlayers on device performance, focusing on contact characteristics and current stability.
Main Methods:
- Fabrication of LiNbO3 domain wall nanodevices using a self-aligned process.
- Introduction of a 10 nm interlayer (Chromium or Titanium) between LiNbO3 and Copper electrodes.
- Comparative electrical characterization of devices with and without interlayers.
Main Results:
- The Titanium (Ti) interlayer reduced coercive voltage by 82% and increased current density 94-fold.
- A 100 nm device with Ti interlayer achieved 82 ns writing and 12 μs erasing times.
- Enhanced devices showed stable retention (>10^6 s), narrow coercive voltage dispersion (<1000 cycles), and high on/off ratio (10^5 at 400 K).
- The embedded selector exhibited ultrahigh selectivity (>10^6).
Conclusions:
- The optimized fabrication process, particularly with a Ti interlayer, significantly enhances LiNbO3 DWRAM performance.
- These findings validate the potential for high-density nanoscale integration of ferroelectric domain wall memory for advanced applications.
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