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Updated: Jun 22, 2025

Measurements of Local Instantaneous Convective Heat Transfer in a Pipe - Single and Two-phase Flow
Published on: April 30, 2018
Observation of heat pumping effect by radiative shuttling
Yuxuan Li1, Yongdi Dang1, Sen Zhang1
1The National Key Laboratory of Extreme Optics Technology and Instruments, Centre for Optical and Electromagnetic Research, College of Optical Science and Engineering; International Research Center (Haining) for Advanced Photonics, Zhejiang University, Hangzhou, 310058, China.
Researchers experimentally demonstrated heat shuttling, a phenomenon enabling heat flow without a net thermal bias. This effect, achieved using phase change materials, offers controllable heat pumping for advanced thermal management in solid-state technologies.
Area of Science:
- Condensed Matter Physics
- Thermodynamics
- Materials Science
Background:
- Heat shuttling, a non-zero heat flow without average thermal bias, was theoretically predicted in nonlinear heat conduction and photon-mediated heat exchange.
- Previous work explored this effect in atomic lattices and solids with temperature-dependent emissivity.
Purpose of the Study:
- To experimentally validate the heat shuttling phenomenon in solid-state systems.
- To investigate the use of phase change materials for realizing and controlling heat shuttling.
- To explore applications in active thermal management.
Main Methods:
- Utilized composite materials based on phase change materials.
- Periodically modulated the temperature of one or both solids.
- Exploited the phase delay between temperature modulations to control heat flow.
Main Results:
- Experimental proof of the heat shuttling phenomenon was achieved.
- Demonstrated heat pumping with controllable heat flow direction by modulating one solid's temperature.
- Showcased simultaneous temperature modulation to control heat shuttling strength and direction via phase delay.
Conclusions:
- The heat shuttling effect is experimentally verified in phase change material systems.
- This phenomenon offers a promising avenue for active thermal management in solid-state devices.
- Potential applications include cooling, thermal insulation, and amplification of heat exchange.
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