0D/2D Co-Doping Network Enhancing Thermal Conductivity of Radiative Cooling Film for Electronic Device Thermal...

Area of Science:

• Materials Science
• Nanotechnology
• Thermodynamics

Background:

• Radiative cooling offers energy-free electronic device cooling.
• Low thermal conductivity of current materials limits their effectiveness.
• Enhancing both thermal and radiative properties is crucial for high-performance cooling.

Purpose of the Study:

• To develop a multishape codoping strategy for enhancing thermal conductivity and radiative properties.
• To investigate the collaborative effect of zero-dimensional and two-dimensional structures on cooling performance.
• To provide a novel solution for efficient electronic device cooling.

Main Methods:

• Electrostatic self-assembly to prepare hBN-coated hollow SiO2 particles.
• Mixing particles with hBN platelets and doping into a polymer substrate.
• Utilizing discrete dipole approximation theory for mechanism elucidation and optimization.

Main Results:

• Achieved high reflectivity (94.9%) and emissivity (91.2%).
• Enhanced thermal conductivity to 1.32 W m⁻¹ K⁻¹ via a thermal conduction network.
• Demonstrated significant temperature reduction (from 58.8 to 31.3 °C) and high net cooling power (102.5 W m⁻²).

Conclusions:

• The multishape codoping strategy effectively improves radiative cooling performance.
• The composite film exhibits superior thermal conductivity compared to low-conductivity substrates.
• This approach offers a promising pathway for high-efficiency, passive electronic device cooling.