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Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.

Jin Xiao1,2, Qian Zhai1, Jia Luo2

  • 1School of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.

Heliyon
|July 11, 2024
PubMed
Summary
This summary is machine-generated.

This study developed a novel room-temperature soldering technique using ultrasonically assisted lead-free solder on copper microstructures. The Au/Ni-W modification significantly enhances joint strength and reliability, preventing thermal damage to electronic components.

Keywords:
DiffusionElectronic packagingMicrostructureSolderingThin film

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Area of Science:

  • Materials Science and Engineering
  • Surface Science
  • Nanotechnology

Background:

  • High-melting-point lead-free solders cause residual stress and thermal damage in delicate electronic components.
  • Existing soldering methods struggle with reliability issues on advanced microstructures.

Purpose of the Study:

  • To develop a room-temperature soldering method for copper-based microstructures.
  • To enhance the mechanical strength and reliability of soldered electronic components.
  • To mitigate thermal damage and residual stress during the soldering process.

Main Methods:

  • Fabrication of cone-shaped copper microstructures via electrochemical deposition.
  • Sequential plating of amorphous Nickel-Tungsten (Ni-W) alloy and Gold (Au) nanolayers.
  • Ultrasonically assisted transient soldering with lead-free solder (SAC305) at room temperature.
  • Microstructural analysis using Scanning Electron Microscopy (SEM) and X-ray fluorescence (XRF).

Main Results:

  • Achieved instantaneous soldering with an average shear strength of 43.06 MPa.
  • The Au/Ni-W modified interface exhibited minimal voids and a pure toughness fracture mode.
  • The Ni-W layer effectively inhibited excessive interdiffusion and intermetallic compound (IMC) growth.

Conclusions:

  • The Au/Ni-W multilayer modification enables reliable room-temperature soldering of copper microstructures.
  • This technique prevents thermal damage and residual stress, ensuring component safety and reliability.
  • The developed method offers a promising solution for advanced electronic packaging applications.