Efficient Mixed-Type Wafer Defect Pattern Recognition Based on Light-Weight Neural Network

Wafer defect pattern recognition can help engineers improve the production process of semiconductor chips. In real industrial scenarios, the recognition of mixed-type wafer defects is difficult and the production scale of semiconductor wafers is large, which requires high accuracy and speed in wafer defect pattern recognition. This study proposes a light-weight neural network model to efficiently recognize mixed-type wafer defects. The proposed model is constructed via inverted residual convolution blocks with attention mechanisms and large kernel convolution downsampling layers. The inference speed of the inverted residual convolution block is fast, and the attention mechanism can enhance feature extraction capabilities. Large kernel convolutions help the network retain more important feature information during downsampling operations. The experimental results on the real Mixed-type WM38 dataset show that the proposed model achieves a recognition accuracy of 98.69% with only 1.01 M parameters. Compared with some popular high-performance models and light-weight models, our model has advantages in both recognition accuracy and inference speed. Finally, we deploy the model as a TensorRT engine, which significantly improves the inference speed of the model, enabling it to process more than 1300 wafer maps per second.