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Related Experiment Video

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Efficient Mixed-Type Wafer Defect Pattern Recognition Based on Light-Weight Neural Network.

Guangyuan Deng1,2, Hongcheng Wang1

  • 1School of Electrical Engineering and Intelligentization, Dongguan University of Technology, Dongguan 523808, China.

Micromachines
|July 27, 2024
PubMed
Summary
This summary is machine-generated.

This study introduces a lightweight neural network for efficient mixed-type wafer defect recognition in semiconductor manufacturing. The model achieves high accuracy and speed, improving chip production processes.

Keywords:
attention mechanismdefect pattern recognitionlarge kernel convolutionlight-weight neural networkwafer map

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Area of Science:

  • Semiconductor Manufacturing
  • Artificial Intelligence
  • Computer Vision

Background:

  • Wafer defect pattern recognition is crucial for improving semiconductor chip production.
  • Recognizing mixed-type defects in large-scale semiconductor wafer production presents significant challenges requiring high accuracy and speed.

Purpose of the Study:

  • To propose a lightweight neural network model for efficient and accurate recognition of mixed-type wafer defects.
  • To enhance feature extraction and retain important information during downsampling for improved defect recognition.

Main Methods:

  • The proposed model utilizes inverted residual convolution blocks with attention mechanisms for fast inference and enhanced feature extraction.
  • Large kernel convolution downsampling layers are employed to preserve critical feature information.
  • The model was evaluated on the real-world Mixed-type WM38 dataset.

Main Results:

  • The lightweight neural network achieved a recognition accuracy of 98.69% with only 1.01 million parameters.
  • The model demonstrated superior performance in both accuracy and inference speed compared to existing popular models.
  • Deployment as a TensorRT engine enabled processing of over 1300 wafer maps per second.

Conclusions:

  • The proposed lightweight neural network model offers an effective solution for mixed-type wafer defect recognition in semiconductor manufacturing.
  • The model's efficiency and accuracy contribute to optimizing semiconductor production processes.
  • The TensorRT engine deployment highlights the model's practical applicability for high-throughput industrial scenarios.