Local and Global Context-Enhanced Lightweight CenterNet for PCB Surface Defect Detection
Weixun Chen1,2, Siming Meng1,2, Xueping Wang3
1The Information Engineering Institute, Guangzhou Railway Polytechnic, Guangzhou 510430, China.
Sensors (Basel, Switzerland)
|July 27, 2024
Summary
This study introduces LGCL-CenterNet, a lightweight model for real-time printed circuit board (PCB) surface defect detection. It enhances accuracy and speed by combining local and global context features, improving manufacturing quality.
Area of Science:
- Computer Vision
- Artificial Intelligence
- Manufacturing Technology
Background:
- Printed circuit board (PCB) surface defect detection is critical for manufacturing quality.
- Existing computer vision methods for PCB defect detection are computationally intensive and inefficient.
- High-resolution imaging is available, but efficient analysis remains a challenge.
Purpose of the Study:
- To develop a lightweight and efficient model for real-time PCB surface defect detection.
- To improve the accuracy and inference speed of automated optical inspection (AOI) systems.
- To address the computational limitations of current computer vision approaches in PCB manufacturing.
Main Methods:
- Proposed a local and global context-enhanced lightweight CenterNet (LGCL-CenterNet).
- Introduced a two-branch lightweight vision transformer module (LGT) with local (coordinate attention) and global (Bi-Level Routing Attention) attention mechanisms.
- Incorporated a Path Aggregation Network (PANet) for feature fusion and a lightweight prediction head using depthwise separable convolutions.
Main Results:
- LGCL-CenterNet achieved improved mAP@0.5 by 2% and 1.4% compared to CenterNet-ResNet18 and YOLOv8s, respectively.
- The model requires fewer parameters (0.542M) than existing techniques.
- Demonstrated superior detection accuracy and inference speed.
Conclusions:
- LGCL-CenterNet offers enhanced real-time performance and robustness for PCB surface defect detection.
- The proposed method effectively balances detection accuracy and computational efficiency.
- This approach contributes to more efficient and reliable automated inspection in PCB manufacturing.


