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Updated: Jun 18, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Mechanically Interlocked [an]Daisy Chain Adhesives with Simultaneously Enhanced Interfacial Adhesion and Cohesion
Yongming Wang1, Guoquan Liu1, Jun Zhao1
1School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai, 200240, P. R. China.
Researchers developed a robust mechanically interlocked daisy chain network (DC-MIN) adhesive. This innovative material combines mechanical bonds and hydrogen bonding for superior adhesion and cohesion across temperatures.
Area of Science:
- Materials Science
- Polymer Chemistry
- Supramolecular Chemistry
Background:
- Developing robust adhesives with balanced adhesive and cohesive properties is a persistent challenge.
- Traditional adhesives often struggle to maintain performance under varying conditions.
- Mechanical bonds and hydrogen bonding are known to enhance material properties.
Purpose of the Study:
- To design and prepare a novel robust adhesive using mechanically interlocked structures and hydrogen bonding.
- To investigate the synergistic effects of mechanical bonds and hydrogen bonding on adhesive performance.
- To understand the structure-property relationships in advanced adhesive materials.
Main Methods:
- Synthesis of a mechanically interlocked [an]daisy chain network (DC-MIN) adhesive.
- Orthogonal integration of mechanical bonds and 2-ureido-4[1H]-pyrimidone (UPy) hydrogen bonding.
- Comparative analysis with control materials lacking the interlocked structure.
Main Results:
- The DC-MIN adhesive demonstrated robust mechanical properties and strong interfacial bonding.
- The UPy moiety facilitated network formation and substrate interaction.
- The mechanically interlocked daisy chain backbone effectively dissipated stress, enhancing cohesive strength.
- Superior adhesion performance was observed over a wide temperature range compared to controls.
Conclusions:
- The integration of mechanical bonds and H-bonding in DC-MIN adhesives offers a viable strategy for enhanced performance.
- Microscopic mechanical bond dynamics significantly influence macroscopic adhesive properties.
- This work provides a valuable framework for designing next-generation robust adhesives.
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