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Direct Ink Writing of SiCN/RuO2/TiB2 Composite Ceramic Ink for High-Temperature Thin-Film Sensors.
Yusen Wang1, Lida Xu1, Xiong Zhou1
1Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China.
Materials (Basel, Switzerland)
|August 10, 2024
Summary
A novel SiCN/RuO2/TiB2 ceramic ink enables cost-effective, high-performance thin-film sensors for extreme environments. This direct ink writing method ensures accurate temperature and heat flux measurements up to 900°C.
Area of Science:
- Materials Science
- Sensor Technology
- Ceramic Engineering
Background:
- Direct ink writing (DIW) of high-temperature sensors is crucial for extreme environments.
- Existing inks present cost-performance trade-offs.
- Need for robust, high-temperature sensing solutions.
Purpose of the Study:
- Develop a cost-effective, high-performance ceramic ink for DIW.
- Create conformal thin-film sensors for extreme environments.
- Evaluate sensor performance up to 900°C.
Main Methods:
- Formulation of a SiCN/RuO2/TiB2 composite ceramic ink.
- High-temperature annealing to form protective glass phases (B2O3 and SiO2).
- Fabrication of thin-film sensors via DIW on metallic substrates.
Main Results:
- SiCN/RuO2/TiB2 films show enhanced density, adhesion, and resistance to RuO2 volatilization.
- Achieved high linearity (RT to 900°C), stability (0.1%/h at 800°C), and conductivity (4410 S/m).
- Successfully demonstrated conformal temperature and heat flux sensors with a 53 ms response time.
Conclusions:
- The developed ink provides a high-performance, cost-effective solution for high-temperature sensors.
- Demonstrated feasibility for monitoring extreme environments using conformal sensors.
- Potential for applications in aerospace, energy, and industrial monitoring.
