Study of Prefabricated Crack Propagation on Monocrystalline Silicon Surfaces for Grinding Damage Analysis

Crack generation and propagation are critical aspects of grinding processes for hard and brittle materials. Despite extensive research, the impact of residual cracks from coarse grinding on the cracks generated during fine grinding remains unexplored. This study aims to bridge this gap by examining the propagation law of existing cracks under indentation using the extended finite element method. The results reveal that prefabricated cracks with depths less than the crack depth produced on an undamaged surface tend to extend further without surpassing the latter. Conversely, deeper prefabricated cracks do not exhibit significant expansion. A novel method combining indentation and prefabricated cracks with fracture strength tests is proposed to determine crack propagation. Silicon wafers with varying damaged surfaces are analyzed, and changes in fracture strength, measured by the ball-on-ring method, are utilized to determine crack propagation. The experimental results confirm the proposed crack evolution law, validated by damage assessments across different grinding processes, which is suitable for crack damage. The findings demonstrate that residual cracks from coarse grinding are negligible in predicting the maximum crack depth during fine grinding. This research provides a crucial foundation for optimizing the wafer thinning process in 3D stacked chip manufacturing, establishing that changes in fracture strength are a reliable indicator of crack propagation feasibility.