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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
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Thermal Conductive Polymer Composites: Recent Progress and Applications.

Jianfeng Tan1, Yuan Zhang1

  • 1College of Intelligent Systems Science and Engineering, Hubei Minzu University, Enshi 445000, China.

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|August 10, 2024
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High-performance thermal conductive polymer composites (TCPCs) offer solutions for overheating in electronics. This review details methods to improve their thermal conductivity for advanced applications.

Keywords:
advanced applicationpolymer nanocompositesthermal conductive

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Area of Science:

  • Materials Science
  • Polymer Science
  • Nanotechnology

Background:

  • Microelectronics miniaturization necessitates advanced thermal management materials.
  • Thermal conductive polymer composites (TCPCs) offer advantages like low density and ease of processing.
  • Current TCPCs face challenges with lower-than-expected thermal conductivity, limiting high-performance applications.

Purpose of the Study:

  • To comprehensively review progress in thermal conductive polymer composites (TCPCs).
  • To detail thermal conductivity mechanisms and influencing factors in TCPCs.
  • To categorize and summarize methods for enhancing TCPC thermal performance.

Main Methods:

  • Review of existing literature on thermal conductivity mechanisms in polymer composites.
  • Analysis of factors influencing thermal performance: polymer properties, interfacial resistance, filler properties.
  • Categorization and summary of thermal conductivity enhancement strategies for TCPCs.

Main Results:

  • Identified key mechanisms governing thermal conductivity in TCPCs.
  • Discussed the impact of polymer matrix, fillers, and interfacial resistance on thermal performance.
  • Summarized various techniques for improving the thermal conductivity of polymer composites.

Conclusions:

  • TCPCs show significant potential for thermal management despite current limitations.
  • Further research is needed to overcome challenges and optimize TCPC performance.
  • Future directions include applications in flexible electronics, personal thermal management, and aerospace.