Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

Electronic devices continue to shrink in size while increasing in performance, making excess heat dissipation challenging. Traditional thermal interface materials (TIMs) such as thermal grease and pads face limitations in thermal conductivity and stability, particularly as devices scale down. Carbon nanotubes (CNTs) have emerged as promising candidates for TIMs because of their exceptional thermal conductivity and mechanical properties. However, the thermal conductivity of CNT films decreases when integrated into devices due to defects and bundling effects. This study employs a novel cross-sectional approach combining high-vacuum scanning thermal microscopy (SThM) with beam-exit cross-sectional polishing (BEXP) to investigate the nanoscale morphology and thermal properties of vertically aligned CNT bundles at low and room temperatures. Using appropriate thermal transport models, we extracted effective thermal conductivities of the vertically aligned nanotubes and obtained 4 W m^-1 K^-1 at 200 K and 37 W m^-1 K^-1 at 300 K. Additionally, non-negligible lateral thermal conductance between CNT bundles suggests more complex heat transfer mechanisms in these structures. These findings provide unique insights into nanoscale thermal transport in CNT bundles, which is crucial for optimizing novel thermal management strategies.