Significant improvement of n-contact performance and wall plug efficiency of AlGaN-based deep ultraviolet...

The reactive ion etching (RIE) process is needed to fabricate deep ultraviolet (DUV) light-emitting diodes (LEDs). However, the n-contact performance deteriorates when the high-Al n-AlGaN surface undergoes RIE, leading to decreased LED performance. In this study, we employed an atomic layer etching (ALE) technology to eliminate surface damage generated during the mesa etching process, thus enhancing the n-Al_0.65Ga_0.35N ohmic contact. The improved contact performance reduced LED operation voltage and mitigated device heat generation. It was observed that DUV LEDs treated with 200 cycles of ALE showed a reduction in operating voltage from 8.3 to 5.2 V at 10 mA, with a knee voltage of 4.95 V. The peak wall plug efficiency (WPE) was approximately 1.74 times that of reference devices. The x-ray photoelectron spectroscopy (XPS) analysis revealed that ALE removed the surface damage layer induced by plasma etching, eliminating surface nitrogen vacancies and increasing surface electron concentration. Consequently, it facilitated better ohmic contact formation on n-Al_0.65Ga_0.35N. This study demonstrates that the ALE technology achieves etching with minor surface damage and is suitable for use in III-nitride materials and devices to remove surface defects and contaminations, leading to improved device performance.