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Updated: Jun 16, 2025

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Liyang Chen1, Julian Schmid1, Anetta Platek-Mielczarek1
1Laboratory for Multiphase Thermofluidics and Surface Nanoengineering, Department of Mechanical and Process Engineering, ETH Zurich, Sonneggstrasse 3, CH-8092 Zurich, Switzerland.
A new photolithography-transfer-plating method creates durable micropatterns on 3D metal surfaces. This technique enables precise control and enhances applications in microelectronics and energy, overcoming weak adhesion issues of traditional methods.
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