Preparation and Properties of Fluorinated Poly(aryl ether)s with Ultralow Water Absorption and Dielectric Constant by...

Poly(aryl ether) materials are used in a wide range of applications in the communications and microelectronics fields for their outstanding mechanical and dielectric properties. In order to further improve the comprehensive performance, this work reports a series of cross-linkable poly(aryl ether)s (UCL-PAEn) containing trifluoroisopropyl and perfluorobiphenyl structures using 2,2-bis(4-hydroxyphenyl)hexafluoropropane, 2,2'-diallyl bisphenol A, and perfluorobiphenyl as starting materials. Their chemical structures and the effect of changes in the allyl content on the properties are thoroughly investigated. Owing to the introduction of fluorine atoms and cross-linked networks, the cross-linked poly(aryl ether) films present low dielectric constants (D_k = 1.93-2.24 at 1 MHz), low water absorption (0.14% -0.25%), and hydrophobic film surfaces (94.3-99.4°). Additionally, because of the presence of cross-linked networks, the CL-PAEn films exhibit superior thermal stability, with the 5% weight loss temperatures all above 445 °C and the maximum thermal decomposition rate temperatures all above 550 °C. The cross-linked films also demonstrate excellent mechanical properties, with tensile strength in the range of 57.1 -146.7 MPa and tensile modulus in the range of 1.8 GPa-4.5 GPa.