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Updated: Jun 15, 2025

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
Excellent Hole Mobility and Out-of-Plane Piezoelectricity in X-Penta-Graphene (X = Si or Ge) with Poisson's Ratio
Sitong Liu1, Xiao Shang1, Xizhe Liu1
1Institute of Atomic and Molecular Physics, Jilin University, Changchun 130012, China.
Abstract:
Recently, the application of two-dimensional (2D) piezoelectric materials has been seriously hindered because most of them possess only in-plane piezoelectricity but lack out-of-plane piezoelectricity. In this work, using first-principles calculation, by atomic substitution of penta-graphene (PG) with tiny out-of-plane piezoelectricity, we design and predict stable 2D X-PG (X = Si or Ge) semiconductors with excellent in-plane and out-of-plane piezoelectricity and extremely high in-plane hole mobility. Among them, Ge-PG exhibits better performance in all aspects with an in-plane strain piezoelectric coefficient d11 = 8.43 pm/V, an out-of-plane strain piezoelectric coefficient d33 = -3.63 pm/V, and in-plane hole mobility μ = 57.33 × 103 cm2 V-1 s-1. By doping Si and Ge atoms, the negative Poisson's ratio of PG approaches zero and reaches a positive value, which is due to the gradual weakening of the structure's mechanical strength. The bandgaps of Si-PG (0.78 eV) and Ge-PG (0.89 eV) are much smaller than that of PG (2.20 eV), by 2.82 and 2.47 times, respectively. This indicates that the substitution of X atoms can regulate the bandgap of PG. Importantly, the physical mechanism of the out-of-plane piezoelectricity of these monolayers is revealed. The super-dipole-moment effect proposed in the previous work is proved to exist in PG and X-PG, i.e., it is proved that their out-of-plane piezoelectric stress coefficient e33 increases with the super-dipole-moment. The e33-induced polarization direction is also consistent with the super-dipole-moment direction. X-PG is predicted to have prominent potential for nanodevices applied as electromechanical coupling systems: wearable, ultra-thin devices; high-speed electronic transmission devices; and so on.
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