Optimization of Heat-Dissipation Structure of High-Power Diode Laser in Space Environments

Area of Science:

• Aerospace Engineering
• Thermal Management
• Optoelectronics

Background:

• High-power laser diodes (HPLDs) are increasingly vital in the rapidly evolving aerospace industry.
• Ensuring thermal reliability of HPLDs in space environments is critical, necessitating optimized heat dissipation structures and improved heat conduction.

Purpose of the Study:

• To theoretically analyze and numerically simulate the thermal performance of HPLDs in space.
• To optimize the heat-dissipation structure of microchannel heat sinks (MCHS) for enhanced thermal reliability.
• To investigate the applicability of optimized MCHS for higher-power laser bars.

Main Methods:

• Constructed a simulation model of HPLDs based on theoretical analysis for numerical simulation.
• Determined optimal packaging position of laser bars and microchannel heat sink (MCHS) cutting angle.
• Optimized MCHS internal structure using single-factor experiments, orthogonal experiments, and a combination of neural networks and genetic algorithms (GAs) on key parameters (ridge width W1, channel width W2, channel length L1).

Main Results:

• Significantly decreased maximum temperature and thermal resistance of lasers by adjusting the packaging position of laser bars.
• Substantially improved MCHS performance after structural optimization.
• Validated the effectiveness of the optimized MCHS design.

Conclusions:

• Adjusting laser bar packaging position and optimizing MCHS structure are effective strategies for enhancing HPLD thermal reliability in space.
• The optimized MCHS demonstrates improved performance and potential applicability to higher-power laser bars.
• This research contributes to the development of more robust optoelectronic systems for space applications.