Processes to enable hysteresis-free operation of ultrathin ALD Te p-channel field-effect transistors
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Summary
This summary is machine-generated.We developed a novel tellurium (Te) atomic layer deposition (ALD) process to overcome limitations in p-type Te transistors. This method significantly reduces hysteresis and off-state current for improved device performance.
Area Of Science
- Materials Science
- Semiconductor Physics
- Nanotechnology
Background
- Tellurium (Te) is a promising p-type semiconductor material.
- Existing Te-based devices suffer from significant I-V hysteresis and high off-state leakage current, hindering practical applications.
- These limitations impede the use of Te in ultrathin p-channel devices.
Purpose Of The Study
- To develop a novel atomic layer deposition (ALD) process for p-type tellurium (Te) field-effect transistors (FETs).
- To address and overcome the critical limitations of large hysteresis and high off-state leakage current in Te-based devices.
- To identify the origins of hysteresis and off-current in Te FETs.
Main Methods
- A novel Te ALD process was developed, incorporating a TeO2 seed layer and Al2O3 passivation.
- 77 K operation studies were conducted to analyze device behavior.
- Passivation process optimization and channel thickness modulation were performed.
Main Results
- The optimized Te FETs exhibited minimal hysteresis (< 23 mV) and high field-effect mobility (33 cm^2 V^-1 s^-1).
- At 77 K, an ultralow off-current (~1 x 10^-14 A), high on/off ratios (~10^8), and a steep subthreshold swing (79 mV dec^-1) were achieved.
- The study identified interfacial defects at the metal-Te contact as the origin of high off-state current.
Conclusions
- The developed Te ALD process effectively mitigates hysteresis and off-state current in p-type Te FETs.
- The findings demonstrate that interfacial defects are the primary cause of high off-state current, which can be resolved through process optimization.
- This work paves the way for the successful application of Te in ultrathin p-channel devices by overcoming major fabrication obstacles.
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