Dispersion strategies of nanomaterials in polymeric inks for efficient 3D printing of soft and smart 3D structures: A...

Nanoscience-often summarized as "the future is tiny"-highlights the work of researchers advancing nanotechnology through incremental innovations. The design and innovation of new nanomaterials are vital for the development of next-generation three-dimensional (3D) printed structures characterized by low cost, high speed, and versatile capabilities, delivering exceptional performance in advanced applications. The integration of nanofillers into polymeric-based inks for 3D printing heralds a new era in additive manufacturing, allowing for the creation of custom-designed 3D objects with enhanced multifunctionality. To optimize the use of nanomaterials in 3D printing, effective disaggregation techniques and strong interfacial adhesion between nanofillers and polymer matrices are essential. This review provides an overview of the application of various types of nanomaterials used in 3D printing, focusing on their functionalization principles, dispersion strategies, and colloidal stability, as well as the methodologies for aligning nanofillers within the 3D printing framework. It discusses dispersive methods, synergistic dispersion, and in-situ growth, which have yielded smart 3D-printed structures with unique functionality for specific applications. This review also focuses on nanomaterial alignment in 3D printing, detailing methods that enhance selective deposition and orientation of nanofillers within established and customized printing techniques. By emphasizing alignment strategies, we explore their impact on the performance of 3D-printed composites and highlight potential applications that benefit from ordered nanoparticles. Through these continuing efforts, this review shows that the design and development of the new class of nanomaterials are crucial to developing the next generation of smart 3D printed architectures with versatile abilities for advanced structures with exceptional performance.