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Published on: August 12, 2018
Hanjui Chang1,2, Yue Sun3,4, Shuzhou Lu3,4
1Department of Mechanical Engineering, College of Engineering, Shantou University, Shantou, 515063, China. changhj@stu.edu.cn.
Optimizing injection molding parameters for brain-computer interfaces (BCI) significantly reduces node displacement. This advancement enhances the reliability of noninvasive BCIs by minimizing damage to integrated electronic components.
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