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Solid State Additive Manufacturing of Thermoset Composites.

Bo Hong1,2, Kaifeng Wang1,3, Yang Li4

  • 1Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, Tianjin 300354, China.

Polymers
|September 14, 2024
PubMed
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This study introduces a novel additive manufacturing method for thermosets using composite powders and stepwise curing. This approach significantly enhances deformation resistance and reduces curing time in fabricated parts.

Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Polymer Chemistry

Background:

  • Additive manufacturing of thermosets faces challenges with softening and deformation during processing.
  • Thermal-curable thermosets require precise temperature control to prevent unwanted deformation.

Purpose of the Study:

  • To develop an additive manufacturing approach for thermosets that mitigates deformation during fabrication.
  • To investigate the use of composite powders with distinct curing temperatures and stepwise curing for improved thermoset processing.

Main Methods:

  • Preparation of thermosetting composite powders with varied curing temperatures.
  • Fabrication of samples using cold spray additive manufacturing (CSAM).
  • Implementation of stepwise curing for individual powder components.
Keywords:
additive manufacturingcold spraythermosets

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Main Results:

  • CSAM process induces plastic deformation and heat generation, causing localized melting and particle bonding.
  • Composite powder samples exhibited superior deformation resistance compared to single-component powders.
  • Stepwise curing of composite powders reduced total curing time from 16.7 hours to 1.5 hours.

Conclusions:

  • The proposed CSAM and stepwise curing method effectively addresses deformation challenges in thermoset additive manufacturing.
  • Sequential curing reactions in composite powders provide structural support, minimizing deformation.
  • This approach offers a significant reduction in processing time for thermosetting components.