Study of the influence of spatial effects on the ground surface and buildings in a two-lane tunnel boring

There are a series of engineering risks, such as ground subsidence, building tilt and cracking, in the process of shield tunnel driving through buildings, which have many adverse effects on urban residents and engineers. In particular, the differences in the effects of the interaction of two-lane tunnels on the building structure and ground deformation field are less often considered under different spatial effects such as construction sequences and tunnel spacings. As well as the problem of analyzing the building as a whole out of reality. To solve these problems, the spatial effect of the shield tunnel underpassing the shallow foundation building is simulated by Plaxis3D software to study the sensitivity analysis of surface settlement and the internal forces and deformation law of the building above in the process of tunneling underpassing with different depths of burial H and horizontal distance D of the double line tunnel. The engineering impact zoning method can investigate the safety of tunnels and buildings under different spatial effects when tunnels pass through buildings. The splitting of the building into plates and columns can reveal the forces and deformation laws of different structural parts. The results show that during the construction process of the double-line tunnel, the tunnel constructed first has a "blocking effect" on the tunnel constructed later, which affects the distribution of the disturbance area to a certain extent and changes the curve shape of the settlement trough. When the "blocking effect" occurs, the surface settlement and building deformation will be significantly reduced. In the internal forces of the building, the plate structure is mainly subjected to changes in axial forces, while the column structure is mainly affected by shear forces and bending moments. The factor of safety of tunnels decreases as the tunnel spacing decreases and as the building loads above increase.