Synthesis and analysis of a novel thermal interface material for DC-DC boost converter

Area of Science:

• Materials Science
• Electrical Engineering
• Thermal Management

Background:

• Power electronics require robust thermal management to prevent failures and ensure reliability.
• Thermal interface materials (TIMs) are crucial for efficient heat transfer between components and heat sinks.
• Existing TIMs face challenges in maintaining performance at high operating temperatures.

Purpose of the Study:

• To develop and evaluate a novel Tungsten-Gallium based thermal interface material (TIM).
• To enhance the thermal conductivity and viscosity of Gallium-based TIMs using Tungsten microparticles.
• To assess the performance of the novel TIM in a DC-DC boost converter circuit.

Main Methods:

• Synthesis and characterization of three TIM samples with varying Tungsten content.
• Surface morphology, composition, and topography analysis using Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM).
• Thermal and electrical characterization using a thermal constant analyzer and a DC-DC boost converter circuit.

Main Results:

• Tungsten addition significantly improved TIM viscosity and fluidity, maintaining stability at high temperatures (up to 308°C).
• A 10% Tungsten addition increased Gallium's thermal conductivity by 74.2% (from 13.1 to 22.82 W/m·K) at room temperature.
• The proposed TIM enhanced MOSFET switching frequency to 20 kHz and reduced conduction losses in a boost converter.

Conclusions:

• The novel Tungsten-Gallium TIM offers superior thermal performance and stability for demanding power electronics applications.
• This material advancement contributes to improved reliability, efficiency, and operational limits in electronic circuits.
• The findings support the use of Tungsten-enhanced Gallium TIMs for next-generation power electronic thermal management solutions.