Fungal Attachment-Resistant Polymers for the Additive Manufacture of Medical Devices

Area of Science:

• Biomaterials Science
• Polymer Chemistry
• Medical Device Engineering

Background:

• Biofilms on indwelling medical devices, particularly from Candida albicans, cause life-threatening infections.
• Poly(dimethylsiloxane) (PDMS) is widely used but susceptible to microbial attachment.
• There is a need for antifungal-resistant, flexible materials suitable for advanced manufacturing.

Purpose of the Study:

• To develop a novel copolymer material resistant to fungal attachment and biofilm formation.
• To create a material with elasticity suitable for flexible medical devices and compatible with 3D printing.
• To avoid using antifungal agents, thereby preventing antifungal resistance.

Main Methods:

• Synthesis and characterization of eight homopolymers and 30 copolymers with varied glass transition temperatures (Tg).
• Evaluation of material and processing properties, including fungal anti-attachment capabilities.
• Testing for suitability in 3D printing (3DP) via material jetting.

Main Results:

• A specific copolymer ratio of triethylene glycol methyl ether methacrylate (TEGMA) and (r)-α-acryloyloxy-β,β-dimethyl-γ-butyrolactone (AODMBA) at 40:60 demonstrated optimal properties.
• The selected copolymer exhibited excellent fungal anti-attachment characteristics and sufficient elasticity.
• Successful 3D printing of a voice prosthesis valve-flap using the developed copolymer was achieved.

Conclusions:

• The TEGMA-AODMBA copolymer represents the first material offering fungal resistance, non-killing mechanism, elasticity, and 3DP suitability.
• This material innovation can lead to safer, personalized medical devices, significantly reducing the incidence of device-associated fungal infections.
• The study validates a new approach to combating medical device-related fungal infections through advanced material design.