Characterizing the Effect of Filament Moisture on Tensile Properties and Morphology of Fused Deposition Modeled...

Moisture absorption into hygroscopic/hydrophilic materials used in fused deposition modeling (FDM) can diminish desired mechanical properties. Sensitivity to moisture is dependent on material properties and environmental factors and needs characterization. In this article, moisture sensitivity of four grades of polylactic acid (PLA) filaments and four different ratios of PLA/polybutylene succinate (PBS) blended filaments were characterized through FDM printed American society for testing and materials (ASTM-D638) test samples after conditioning the filaments at different relative humidity levels. The tensile testing and scanning electron microscopy (SEM) of the samples' fracture surfaces revealed that PLA 4043D was the most moisture-sensitive among the chosen grades of PLA filaments. Through filament tension test and melt flow index (MFI) testing it was observed that moisture had a significant detrimental effect (20% reduction in tensile strength and 50% increase in MFI) on PLA 4043D filaments. Samples from moisture-conditioned PLA/PBS 75/25 blended filaments displayed a significant reduction (10%) in tensile strength. Moreover, the MFI of 75/25 filaments was increased with subsequent increases in moisture level. Investigation of tensile properties of ASTM samples made from four grades of PLA filaments exposed to room temperature and humidity conditions for 3 months showed an even more significant decrease in strength (ranging from 24% to 36%).