Influence of diode laser irradiation on microtensile bond strength of etch-and-rinse adhesive to dentin using two different etchants: An in vitro study
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Published on: May 9, 2022
Asmita Sadanand Naik1, Ida De Noronha De Ataide1, Marina Fernandes1
1Department of Conservative Dentistry and Endodontics, Goa Dental College and Hospital, Bambolim, Goa, India.
Aim:
The aim of this study was to evaluate the influence of 970 nm diode laser (DL) irradiation on the microtensile bond strength (µTBS) of etch-and-rinse adhesive (ERA) to dentin using phosphoric acid (PA) or alpha-hydroxy glycolic acid (GA) as etchants.
Materials And Methods:
A total of 32 human third molars were selected and assigned randomly among two different groups and four subgroups based on etching protocols and DL irradiation: PA, PA-DL, GA, and GA-DL. After tooth preparation and subsequent incremental composite build-up, the samples were stored in distilled water for 24 h at 37°C. µTBS values were obtained using the universal testing machine. The failure modes observed in dentin were categorized as adhesive, cohesive within dentin/resin, or mixed.
Statistical Analysis:
The data were analyzed using one-way analysis of variance, followed by Tukey's post hoc test (P ≤ 0.001).
Results:
GA showed better or similar bond strength values to PA. Furthermore, irradiation of DL increased the µTBS to dentin when both PA or GA are used as etchants.
Conclusion:
GA can be used as an alternative etchant to PA. DL irradiation stands as a promising approach for elevating the performance of ERA adhesive systems to dentin.
