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Updated: Jun 11, 2025

Ohmic Contact Fabrication Using a Focused-ion Beam Technique and Electrical Characterization for Layer Semiconductor Nanostructures
Published on: December 5, 2015
MoS2high temperature sensitive element with a single Si3N4protective layer
Lingbing Kong1, Yuning Li2, Yuqiang Wang1
1Beijing Jiaotong University, No.3 Shangyuancun Haidian District Beijing 100044 P. R. China, Beijing, 100044, CHINA.
Abstract:
Temperature sensors find extensive applications in industrial production, defense, and military sectors. However, conventional temperature sensors are limited to operating temperatures below 200°C and are unsuitable for detecting extremely high temperatures. In this paper, a method for thermal protection of molybdenum disulfide (MoS2) films is proposed and a MoS2 high temperature sensor is prepared. By depositing a monolayer of Si3N4 onto MoS2, not only is the issue of high-temperature oxidation effectively addressed, but also the contamination by impurities that could potentially compromise the performance of MoS2 is prevented. Moreover, the width of the Schottky barrier of metal/MoS2 is reduced by using PECVD deposition of 400 nm Si3N4 to form an ohmic contact, which improves the electrical performance of the device by three orders of magnitude. The sensor exhibits a positive temperature coefficient measurement range of 25 to 550°C, with a maximum temperature coefficient of resistance (TCR) of 0.32%·°C-1. The thermal protection method proposed in this paper provides a new idea for the fabrication of high-temperature sensors, which is expected to be applied in the high-temperature field. .
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