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Damage detection and localization in plate-like structures using sideband peak count (SPC) technique.

Bo Hu¹, Tribikram Kundu²

¹Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USA; Department of Civil and Architectural Engineering and Mechanics, University of Arizona, Tucson, AZ 85721, USA.

|October 10, 2024

Summary

This study introduces the sideband peak count (SPC) technique for efficient damage detection in plate structures. The method accurately identifies damage location without needing a baseline, improving structural health monitoring.

Keywords:

Damage detection & localization Elastic wave propagation Finite element modeling Sideband peak count-index (SPC-I)Structural health monitoring

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Area of Science:

Engineering
Materials Science
Structural Health Monitoring

Background:

Plate-like structures are vital in aerospace and marine engineering.
Detecting and localizing damage in these structures is critical for safety and performance.
Existing methods often require extensive sensor data or baseline references.

Purpose of the Study:

To introduce a novel damage detection algorithm for plate structures.
To develop a technique that requires minimal sensor data and no baseline reference.
To enable rapid and precise damage localization.

Main Methods:

The study proposes the sideband peak count (SPC) technique.
The algorithm utilizes a limited number of sensor responses.
Finite element simulations are employed for validation.

Main Results:

The SPC technique demonstrates accurate damage detection and localization capabilities.
The method's efficiency is enhanced by eliminating the need for a reference baseline.
Simulations confirm the algorithm's effectiveness in identifying damage location.

Conclusions:

The sideband peak count (SPC) technique offers a promising solution for structural health monitoring.
This approach enhances the reliability and efficiency of damage assessment in plate structures.
The method has broad applicability in aerospace, marine, and other engineering fields.