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Published on: June 21, 2015
Influence of copper ion cross-linked CMC-PVA film on cell viability and cell proliferation study
Neha R Thakare1, Pronami Gogoi2, Pankaj Bharali2
1Chemical Engineering Group and Centre for Petroleum Research, CSIR-North East Institute of Science and Technology, Jorhat, Assam 785006, India; Academy of Scientific and Innovative Research (AcSIR), Ghaziabad, Uttar Pradesh 201002, India.
Abstract:
In this study, films composed of carboxymethyl cellulose and polyvinyl alcohol were fabricated using the solution casting method. Citric acid (4 %) was employed as a cross-linking agent, while glycerol (3 %) as a plasticizer. Cupric chloride (CuCl2·2H2O) was used for cross-linking at concentrations 0.5 %, 1 %, and 3 % over different times. The cross-linking with copper ions led to a noticeable reduction in elasticity, with the breaking strain ranging from 17.9 %-52.9 %, and increased the contact angle. The ion hydration phenomenon increased the swelling ratio of the films. Fourier-transform infrared (FTIR) spectroscopy confirmed the esterification reactions and copper ion cross-linking with sodium carboxymethyl cellulose (Na-CMC). The films showed antibacterial activity against Staphylococcus aureus and Escherichia coli. The ion-released mechanism followed was the non-Fickian super case-II type. The concentration and duration of cross-linking significantly influenced the cell viability and proliferation. FE-SEM analysis revealed that effective concentrations of CuCl2.2H2O were 0.5 % and 1 %, and the cross-linking times were 5-15 min, facilitating cell attachment and proliferation. Films are non-adhesive with water vapor permeation 800-900 g/m2/day. These results indicate the potential use of the films in treating second-degree burn wounds with low to medium exudate levels. This study provides valuable insights into the development of copper-infused materials for advanced wound healing applications.

