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Related Concept Videos

Additives and Fillers in Concrete01:29

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  11. Core-shell Engineered Fillers Overcome The Electrical-thermal Conductance Trade-off.
  1. Home
  3. Research Domains
  5. Engineering
  7. Materials Engineering
  9. Wearable Materials
  11. Core-shell Engineered Fillers Overcome The Electrical-thermal Conductance Trade-off.

Related Experiment Video

Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
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Core-Shell Engineered Fillers Overcome the Electrical-Thermal Conductance Trade-Off.

PeiChi Liao1, Haichang Guo1, Hongyu Niu1

  • 1School of Materials Science and Engineering, Peking University, Beijing 100871, China.

ACS Nano
|October 24, 2024

View abstract on PubMed

Summary
This summary is machine-generated.

Researchers developed new core-shell fillers to manage heat in electronics. These materials offer high thermal conductivity and electrical insulation, outperforming commercial options for advanced electronic packaging.

Keywords:
core−shellelectrical resistivitypechini methodthermal conductivity

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Modern electronics require thermal management materials with tunable electrical properties (conductive, dielectric, insulating).
  • A key challenge is the trade-off between high thermal conductivity and high electrical conductivity in existing materials.
  • Electrically insulating, yet highly thermally conductive materials are scarce, limiting diverse electronic applications.

Purpose of the Study:

  • To overcome the electrical-thermal conductance trade-off in thermal management materials.
  • To develop a versatile and robust method for preparing engineered core-shell fillers.
  • To create advanced composite materials for thermal management in electronic packaging.

Main Methods:

  • A facile Pechini-based method was employed to synthesize multiple core (metal)/shell (metal oxide) engineered fillers.
thermal management
  • Examples include aluminum-oxide-coated and beryllium-oxide-coated silver (Ag) microspheres.
  • The method was combined with ultrafast joule heating treatment for versatility with varied filler sizes, including large ones.

    • Main Results:

    • The synthesized core-shell fillers, when compounded into epoxy composites, exhibited high isotropic thermal conductivity (approximately 3.8 W m⁻¹ K⁻¹).
    • These composites maintained high electrical resistivity (approximately 10¹² Ω cm) and good flowability.
    • The resulting composites demonstrated superior heat dissipation compared to commercial thermally conductive packaging materials.

    Conclusions:

    • The developed core-shell fillers enable the creation of thermally conductive composites with controlled electrical properties.
    • This approach offers a robust solution for emerging electronic packaging applications requiring efficient thermal management.
    • Demonstrated applications include circuit board and battery thermal management, highlighting practical utility.