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Compliant Interconnects Based on Single Micrometer-sized Metal-Coated Polymer Spheres.

Van Long Huynh1, Knut E Aasmundtveit1, Hoang-Vu Nguyen1

  • 1Department of Microsystems, University of South-Eastern Norway, Raveien 215, 3184 Borre, Norway.

ACS Applied Materials & Interfaces
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Summary

This study introduces a novel compliant interconnect method using metal-coated polymer spheres and silver nano ink. This low-force, low-temperature technique enhances thermo-mechanical robustness for high-density electronics.

Keywords:
compliant interconnectslow bonding pressurelow bonding temperaturemetal-coated polymer particlesnano Ag inkparticle deposition

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Multifunctional electronics require advanced interconnection technologies for high-density, ultrafine pitch applications.
  • Existing methods face challenges with high bonding forces and thermo-mechanical stress due to material mismatches.
  • There is a need for robust, compliant interconnects suitable for large dies.

Purpose of the Study:

  • To propose and demonstrate a novel compliant interconnect approach for high-density electronics.
  • To address the limitations of current interconnection technologies regarding force and thermal stress.
  • To enhance the thermo-mechanical robustness and interconnect performance for advanced packaging.

Main Methods:

  • Utilizing single micrometer-sized metal-coated polymer spheres as interconnects.
  • Employing low-temperature (140 °C) and low-pressure (∼15 mN/particle) sintering of silver (Ag) nano ink for joining.
  • Demonstrating controlled particle placement and achieving high success rates in individual interconnects.

Main Results:

  • Achieved a 98% success rate in forming individual interconnects with controlled particle capture.
  • Sintered Ag nano ink secured particles with adhesion force > 2 μN and reduced interconnect resistance by 15%.
  • Measured interconnect resistance as low as 0.5 Ω, offering an alternative to traditional metallurgical joints.

Conclusions:

  • The proposed method offers a viable, compliant interconnection technology for high-density, ultrafine pitch applications.
  • Low bonding pressure and temperature enhance thermo-mechanical robustness and reduce package stress.
  • This approach provides an alternative to metallurgical joints, improving performance and reliability in electronic packaging.