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Planar and Three-Dimensional Printing of Conductive Inks

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Laser Sintering by Spot and Linear Optics for Inkjet-Printed Thin-Film Conductive Silver Patterns with the Focus on

Dana Mitra¹, Kalyan Yoti Mitra¹, Georg Buchecker¹

¹Fraunhofer Institute for Electronic Nano Systems ENAS, 09126 Chemnitz, Germany.

|October 26, 2024

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Laser sintering of inkjet-printed silver inks using spot and line optics offers a fast, efficient method for creating conductive patterns on flexible films. This technique achieves high conductivity suitable for printed electronics applications.

Area of Science:

Materials Science
Additive Manufacturing
Nanotechnology

Background:

Inkjet printing enables precise deposition of functional inks.
Sintering is crucial for converting printed non-conductive precursors into conductive materials.
Traditional sintering methods can be slow or damage flexible substrates.

Purpose of the Study:

To investigate laser sintering of inkjet-printed nanoparticle and metal organic decomposition (MOD) inks on flexible polymeric films.
To compare the effectiveness of spot laser and line laser optics for sintering.
To identify optimal laser parameters for achieving high conductivity without substrate damage.

Main Methods:

Systematic variation of laser speed and power for both spot (3.2 mm diameter) and line (2 mm × 80 mm) laser optics.

Keywords:

flexible electronics inkjet printing technology laser sintering nanoparticle silver ink

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Analysis of conductivity in resulting silver structures.

Evaluation of substrate and silver layer integrity post-sintering.

Main Results:

Optimal process windows were identified for each ink and laser optic.
Laser speeds between 50-100 mm/s are compatible with inkjet printing for in-line processing.
One nanoparticle silver ink achieved 36% bulk silver conductivity (2.22 × 10^7 S/m) using the line laser optic.

Conclusions:

Laser sintering is a viable and efficient method for producing conductive silver layers on flexible substrates.
Both spot and line laser optics provide flexibility for sintering defined areas or larger regions.
This technology holds significant promise for applications in printed electronics.