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Progress in Research on Co-Packaged Optics.

Wenchao Tian1,2, Huahua Hou1, Haojie Dang1

  • 1School of Electro-Mechanical Engineering, Xidian University, Xi'an 710071, China.

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Summary

Co-packaged optics (CPO) offers enhanced bandwidth, reduced size, and lower power consumption for 5G data demands. This study reviews CPO principles, applications, and challenges in advanced packaging.

Keywords:
advanced packagingco-packaged opticsoptoelectronic integrationsilicon photonics integration

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Area of Science:

  • Optoelectronics and Photonics
  • Integrated Circuit Packaging
  • Telecommunications Technology

Background:

  • The 5G era necessitates high-bandwidth computing, transmission, and storage, driving optoelectronic interconnect technology evolution.
  • Traditional board-edge optical modules are transitioning to smaller, more integrated solutions like Co-packaged Optics (CPO).
  • CPO addresses growing data demands, offering significant advantages over conventional optoelectronic connectivity.

Purpose of the Study:

  • To provide a comprehensive overview of Co-packaged Optics (CPO).
  • To highlight CPO's fundamental principles, advantages, and unique features.
  • To examine research progress in VCSEL and silicon photonics integration for CPO, analyze applications, and predict future trends.

Main Methods:

  • Review of Co-packaged Optics (CPO) principles and benefits.
  • Examination of Vertical-Cavity Surface-Emitting Laser (VCSEL) and silicon photonics integration approaches.
  • Analysis of CPO applications across 2D, 2.5D, and 3D packaging techniques.

Main Results:

  • CPO demonstrates superior bandwidth, size, weight, and power efficiency compared to traditional optoelectronics.
  • Significant progress is noted in VCSEL and silicon photonics integration for CPO.
  • Diverse applications of CPO are identified, utilizing various advanced packaging methods.

Conclusions:

  • Co-packaged Optics (CPO) is a key enabling technology for future high-bandwidth data networks.
  • Ongoing research in integration technologies and packaging is crucial for CPO advancement.
  • Addressing current scientific obstacles will pave the way for widespread CPO adoption and future innovation.