Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard-Brittle Materials
Dawei An1,2, Jianghui Xian1, Yi Zhang1
1School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China.
Micromachines
|October 26, 2024
Summary
Ultrasonic local resonant grinding significantly enhances sapphire processing. This advanced method achieves superior surface quality and higher material removal rates compared to conventional ultrasonic grinding.
Area of Science:
- Materials Science
- Mechanical Engineering
- Manufacturing Technology
Background:
- Hard-brittle materials like sapphire are crucial in optics, electronics, and aviation.
- Traditional processing methods struggle with high hardness and brittleness, limiting efficiency and surface quality.
Purpose of the Study:
- To investigate ultrasonic local resonant grinding for sapphire processing.
- To improve processing efficiency and achieve ultra-precision surface roughness for optical windows.
Main Methods:
- Simulation and testing of a piezoelectric ultrasonic vibration system's resonant frequency.
- Measurement of grinding head vibration amplitude.
- Experimental ultrasonic grinding of sapphire using a local resonant system.
Main Results:
- Achieved a surface roughness parameter (Ra) of 14 nm and surface flatness of 44.2 nm for sapphire.
- Reduced surface roughness by 90.79% and improved surface flatness by 81.58% compared to conventional resonant systems.
- Increased material removal rate by 31.35%.
Conclusions:
- Ultrasonic local resonant grinding effectively meets ultra-precision requirements for sapphire.
- This method offers superior surface quality and increased material removal rates over conventional ultrasonic grinding.
