Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Search research articles

Related Experiment Video

Updated: Jun 9, 2025

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Published on: April 10, 2017

Grain Structure Engineering in Screen-Printed Silver Flake-Based Inks for High-Temperature Printed Electronics

Arjun Wadhwa¹, Mohammad Saadati¹, Jaime Benavides-Guerrero¹

¹Department of Electrical Engineering, École de Technologie Supérieure, 1100 Notre Dame Street West, Montreal, QC H3C 1K3, Canada.

Materials (Basel, Switzerland)

|October 26, 2024

Summary

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Controlled microstructural evolution of Hydroxyapatite-Bioglass® nanocomposites via two-step sintering.

Journal of the mechanical behavior of biomedical materials·2026

Same author

Assessment of KN95 Mask Filtering Degradation and Breathing Detection: A Pilot Study.

Sensors (Basel, Switzerland)·2025

Same author

Exchange Bias in La<sub>0.67</sub>Sr<sub>0.33</sub>MnO<sub>3</sub>/YFeO<sub>3</sub> Ferromagnet/Antiferromagnet Multilayer Heterostructures.

Small (Weinheim an der Bergstrasse, Germany)·2025

Same author

Controlling the Optical and Electrical Properties of Perovskite Films and Enhancing Solar Cell Performance Using the Photonic Curing Process.

Nanomaterials (Basel, Switzerland)·2024

Same author

Enhancing the Performance of Nanocrystalline SnO<sub>2</sub> for Solar Cells through Photonic Curing Using Impedance Spectroscopy Analysis.

Nanomaterials (Basel, Switzerland)·2024

Same author

Impact of Residual Strains on the Carrier Mobility and Stability of Perovskite Films.

Nanomaterials (Basel, Switzerland)·2024

This summary is machine-generated.

Adding silicon particles to silver inks significantly enhances their thermal stability. This grain boundary pinning allows for stable electrical conductivity at temperatures up to 700 °C, doubling the operational limit for screen-printed silver flake inks.

Area of Science:

Materials Science
Nanotechnology
Metallurgy

Background:

Screen-printed silver flake inks are widely used but limited by thermal instability.
High operating temperatures cause grain growth, degrading electrical conductivity.

Purpose of the Study:

To investigate the effect of silicon inclusions on the grain structure and thermal stability of screen-printed silver inks.
To enhance the operational temperature range of silver flake inks.

Main Methods:

Electron backscattered diffraction (EBSD) for grain size analysis.
Thermal stability testing via isothermal exposures (10 min to 4 h) at temperatures from 250 °C to 900 °C.
Measurement of electrical conductivity and resistivity.

Keywords:

X-ray photoelectron spectroscopy (XPS)electron backscattered diffraction (EBSD)grain boundary pinning high-temperature devices printed electronics screen printing silicon particles silver flake ink

More Related Videos

Planar and Three-Dimensional Printing of Conductive Inks

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

Hybrid Printing for the Fabrication of Smart Sensors

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

Related Experiment Videos

Last Updated: Jun 9, 2025

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Challenges in Rheological Characterization of Highly Concentrated Suspensions — A Case Study for Screen-printing Silver Pastes

Published on: April 10, 2017

Planar and Three-Dimensional Printing of Conductive Inks

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

Hybrid Printing for the Fabrication of Smart Sensors

Hybrid Printing for the Fabrication of Smart Sensors

Published on: January 31, 2019

Main Results:

Silver ink with 5 wt.% silicon inclusions exhibited significantly retarded grain growth compared to pristine ink.
Silicon-loaded ink maintained stable electrical conductivity up to 700 °C, a substantial increase from the conventional 400 °C limit.
The activation energy was reduced by 54% due to Zener pinning by silicon particles, inhibiting grain growth.

Conclusions:

Controlled addition of silicon particles to silver inks enables grain structure engineering for enhanced thermal stability.
This approach significantly expands the potential applications of screen-printed metallic inks in high-temperature environments.
The Zener pinning mechanism effectively stabilizes electrical properties at elevated temperatures.