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Updated: Jun 8, 2025

Fabrication of Spatially Confined Complex Oxides
Published on: July 1, 2013
Interface analysis of oxide free MoS2 films fabricated by solution process
Md Iftekharul Alam1, Rikiya Sumichika2, Junichi Tsuchimoto3
1Research Institute for Semiconductor Engineering, Hiroshima University, 1-4-2 Kagamiyama, Higashi-Hiroshima, Hiroshima, 739-8530, Japan. iftekhar@hiroshima-u.ac.jp.
Abstract:
We report a solution-based approach for the synthesis of oxidation-free MoS2 films, focusing on interface analysis. Through a sulfurization-free solution process and single-step annealing, the oxidation-free MoS2 film is successfully prepared on Si3N4 surfaces, showing improved uniformity with a surface roughness below 0.5 nm and a thickness of 4 nm at a precursor solution concentration of 30 mM, annealed between 700 and 800ºC. The MoS2 films exhibit a hexagonal lattice structure with crystallographic orientations of (1 1 0 0) and (1 2 1 0) with lattice spacings of 0.27 nm and 0.16 nm respectively. Interfacial analysis by X-ray photoelectron spectroscopy (XPS) on SiO2 reveals migration of oxygen species as evidenced by a shift in the Si 2p spectrum at binding energies between 102.6 eV and 102.8 eV. MoS2 films on Si3N4 show a complex Si 2p peak evolution at binding energies between 100.9 and 101.8 eV, providing valuable insights into the synthesis of oxide-free MoS2 films for potential applications in advanced electronic devices.
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