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Area of Science:

  • Materials Science
  • Surface Science
  • Mechanical Engineering

Background:

  • Solid-state bonding of metallic microparticles to substrates occurs at supersonic impact velocities.
  • Understanding the properties of these impact-induced bonded interfaces is crucial but remains challenging.

Purpose of the Study:

  • To investigate the interfacial strength across bonded interfaces formed by microparticle impacts.
  • To determine the factors influencing the emergent bond strength at these interfaces.

Main Methods:

  • In situ microparticle impact experiments were conducted.
  • Site-specific micromechanical measurements were employed to assess interfacial strength.
  • Analysis focused on the correlation between oxide form and bond strength.

Main Results:

  • A gradient of bond strength was observed across the bonded interface.
  • Bond strength initially increased significantly beyond bulk material yield strength before reaching a plateau.
  • The form of native oxide (layers, particles, or debris) was identified as a key determinant of bond strength.

Conclusions:

  • The interfacial bond strength in supersonic impacts is not uniform but exhibits a distinct gradient.
  • Native oxide characteristics critically control the achievable bond strength.
  • A predictive framework based on contact pressure and surface exposure can forecast impact-induced bond strength.