Patternable, high-precision, controllable wettability copper layers for 3D resin-based weather-resistant electronics...

Area of Science:

• Materials Science
• Surface Science
• Additive Manufacturing

Background:

• Developing 3D patterned metal layers with tunable wettability is crucial for advanced applications like microelectronics and liquid handling.
• Existing methods face challenges in facile and efficient fabrication of such structures.

Purpose of the Study:

• To propose and demonstrate a novel 3D selective metallization strategy for creating 3D conductive patterns with controllable surface wettability.
• To explore the potential of this method for fabricating functional 3D devices.

Main Methods:

• A hybrid approach combining stereolithography 3D printing with laser-induced selective metallization (LISM).
• Utilized 355 nm UV or 1064 nm lasers for selective copper deposition on 3D-printed resins.
• Investigated surface microstructure, wettability, and laser-induced wettability transformation.

Main Results:

• Successfully fabricated 3D conductive copper patterns with controllable superhydrophobicity (156.6°) and superhydrophilicity.
• The superhydrophobic surfaces exhibited self-cleaning, corrosion resistance, and anti-condensation properties.
• Demonstrated a 3D self-driven flow channel for liquid manipulation and micro-scale chemical experiments.

Conclusions:

• The proposed LISM strategy offers a facile and efficient route to 3D patterned metal layers with tunable wettability.
• This technology enables the fabrication of multifunctional 3D devices for microfluidics and integrated electronics.
• The ability to switch between superhydrophobic and superhydrophilic states opens new possibilities in 3D liquid manipulation.