Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication

The diffusion-bonding technique has been utilized to join various Al alloys (AA1060, AA2024, AA3003) to Cu for bimetallic anode application. This process aims to achieve robust metallic continuity to facilitate electron transfer, while carefully managing the growth of the intermetallic layer at the bonding interface. This control preserves the active volume of aluminum and prevents excessive brittleness of the anode. Optimization efforts have focused on different pressures, surface treatments of parent materials, and bonding parameters (temperature 450-500 °C and time 5-60 min). The optimal conditions identified include low bonding pressures (8 MPa), surface treatment involving polishing followed by chemical cleaning of the surfaces to be bonded, and energetic bonding conditions tailored to each specific aluminum alloy. Preliminary electrochemical characterization via cyclic voltammetry (CV) tests has demonstrated high reversibility intercalation/deintercalation reactions for up to seven cycles. The presence of the different alloying elements appears to contribute significantly to maintaining the high intercalation/deintercalation reaction reversibility without considerable modification of the reaction potentials. This effect may be attributed to alloying elements effectively reducing the overall alloy volume expansion, potentially forming highly reversible ternary/quaternary active phases, and creating a porous reaction layer on the exposed aluminum surface. These factors along with the influence of the Cu parent material collectively reduce the stress during volume expansion, which is the responsible phenomenon of the anode degradation in common Al anodes.