Monolithic full-color micro-LED displays featuring three-dimensional chip bonding and quantum dot-based color...

Area of Science:

• Materials Science
• Optoelectronics
• Display Technology

Background:

• Monolithic full-color micro-LED (µLED) displays are crucial for advanced visual applications.
• Existing fabrication methods face challenges in achieving wide color gamut, high pixel density, and cost-effectiveness.

Purpose of the Study:

• To propose a novel fabrication process for monolithic full-color (RGB) µLED display technology.
• To integrate three-dimensional (3D) and quantum dot (QD)-based color conversion layers.
• To demonstrate a high-performance RGB µLED array with enhanced color gamut and yield.

Main Methods:

• Development of a novel fabrication process incorporating 3D structures and QD color conversion.
• Fabrication of a 16x16 passive matrix (PM) RGB µLED array using flip-chip bonding.
• Characterization of electroluminescence (EL) spectra and color gamut performance with color filters.

Main Results:

• Successful realization of an 80µm pitch, 328 PPI RGB µLED array.
• Achieved a maximum color gamut of 124% NTSC with QD color conversion and filters.
• Reduced risk of QD film damage during photolithography compared to alternative QD methods.

Conclusions:

• The proposed fabrication process offers a promising route for commercialization of advanced µLED displays.
• The integration of 3D structures and QDs enables superior color performance and manufacturing advantages.
• This technology addresses key challenges in producing high-quality, cost-effective full-color µLED displays.