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Published on: March 19, 2016
An On-Chip Second-Order Elastic Topological Insulator for Demultiplexing Out-of-Plane and In-Plane Corner Modes
Yafeng Chen1, Lei Fan1, Jie Zhu2
1Department of Mechanical Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR, 999077, China.
This study introduces a novel second-order elastic topological insulator (SETI) capable of supporting both out-of-plane and in-plane elastic corner states. This breakthrough enables selective control and multiplexing of elastic waves for advanced applications.
Area of Science:
- Condensed Matter Physics
- Materials Science
- Acoustics
Background:
- Second-order elastic topological insulators (SETIs) offer unique localized corner states for elastic wave manipulation.
- Current SETIs are limited to supporting only a single mode (either in-plane or out-of-plane) of corner states.
Purpose of the Study:
- To introduce and demonstrate an on-chip SETI that simultaneously supports both high-frequency out-of-plane and in-plane elastic corner states.
- To enable selective excitation and demultiplexing of these dual-mode corner states.
Main Methods:
- Design and fabrication of a novel on-chip second-order elastic topological insulator.
- Experimental validation of the presence of both out-of-plane and in-plane corner states.
- Frequency-dependent excitation experiments to demonstrate selective mode control.
Main Results:
- Successfully realized an on-chip SETI hosting simultaneous out-of-plane and in-plane corner states at approximately 0.2 MHz.
- Experimentally confirmed the existence of these dual corner states.
- Demonstrated selective excitation of individual modes by tuning the excitation frequency.
Conclusions:
- The developed SETI platform enables simultaneous manipulation of distinct elastic wave modes.
- This capability facilitates the demultiplexing of out-of-plane and in-plane corner states, paving the way for multifunctional elastic devices.
- The simple, scalable design is suitable for integration into on-chip elastic circuits and micro-electromechanical systems (MEMS).
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