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Perspective on 3D vertically-integrated photonic neural networks based on VCSEL arrays
Min Gu1,2, Yibo Dong1,2, Haoyi Yu1,2
1Institute of Photonic Chips, University of Shanghai for Science and Technology, Shanghai 200093 China.
Nanophotonics (Berlin, Germany)
|December 5, 2024
Summary
Vertical-cavity surface-emitting laser (VCSEL) arrays offer a path toward compact, active diffractive neural networks (DNNs). This approach enables on-chip integration for next-generation photonic neural networks.
Area of Science:
- Photonics and Artificial Intelligence
- Integrated Optics and Neural Computing
Background:
- Artificial intelligence advancements drive interest in novel photonic neural network designs.
- Diffractive neural networks (DNNs) excel at high-speed 2D optical data processing but face miniaturization challenges due to centimeter-scale input devices.
- Current DNNs lack on-chip integration capabilities, hindering practical applications.
Purpose of the Study:
- To propose vertical-cavity surface-emitting laser (VCSEL) arrays as a solution for compact, active DNNs.
- To explore VCSEL arrays as an integrated platform for next-generation on-chip photonic neural networks.
- To analyze future directions and challenges for 3D photonic chips based on VCSEL arrays.
Main Methods:
- Conceptualizing the use of addressable VCSEL arrays for data input in DNNs.
- Investigating the potential for micron-scale 3D photonic chips.
- Analyzing the modulation bandwidth capabilities of VCSEL-based photonic chips.
Main Results:
- VCSEL arrays can serve as compact, active data input devices for DNNs.
- Micron-scale 3D photonic chips with tens of GHz modulation bandwidth are feasible using VCSEL arrays.
- This approach facilitates the development of on-chip vertical-stacked photonic neural networks.
Conclusions:
- VCSEL arrays represent a promising technology for miniaturizing and integrating DNNs.
- The proposed platform enables the creation of high-performance, compact photonic neural networks.
- Further research is needed to address the challenges and realize the full potential of 3D photonic chips.

