Mask-Enabled Topography Contrast on Aluminum Surfaces
Trevor J Shimokusu1,2, Hemish Thakkar1, Anam Abbas3
1Department of Mechanical Engineering, Rice University, Houston, Texas 77005, United States.
Researchers developed a scalable method using blade-cut masks to create patterned aluminum surfaces with tunable wettability and emissivity for enhanced liquid transport and thermal management applications.
Area of Science:
- Materials Science
- Surface Engineering
- Nanotechnology
Background:
- Patterned surfaces with wettability contrast are crucial for advanced liquid transport in electronics thermal management, self-cleaning, and anti-icing.
- Aluminum (Al) surfaces are widely used in thermal applications, but methods for creating topography-patterned wettability contrast on Al are limited.
Purpose of the Study:
- To demonstrate an easy and scalable method for creating topography-patterned wettability contrast on aluminum surfaces using blade-cut masking.
- To quantify the accuracy of topographic pattern resolution, surface roughness, wettability, and thermal emissivity of the patterned Al surfaces.
Main Methods:
- Utilized blade-cut vinyl mask templates and a commercial lacquer resin as an etch resist.
- Employed etching processes to create topographic contrast on aluminum surfaces.
- Characterized wettability using contact angle goniometry and thermal emissivity using infrared thermography.
Main Results:
- Achieved wettability contrast from <5° to 80° (etched vs. smooth) and 150° to 120° (etched vs. smooth with hydrophobic coating).
- Demonstrated enhanced droplet shedding on superhydrophobic regions of striped patterned surfaces during condensation.
- Mapped topography-mediated thermal emissivity contrast, with etched regions at ε ≈ 0.65 and smooth regions at ε ≈ 0.26.
Conclusions:
- The blade-cut masking method offers a scalable route to fabricate complex topography-patterned aluminum surfaces with controlled wettability and emissivity.
- These patterned surfaces show potential for applications in vapor chamber thermal rectification, radiative cooling, and high-temperature phase change processes.
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