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A microgripper based on electrothermal Al-SiO2 bimorphs.

Hengzhang Yang1,2, Yao Lu1,2,3, Yingtao Ding1,2

  • 1School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing, China.

Microsystems & Nanoengineering
|December 16, 2024
PubMed
Summary

This study introduces an electrothermal microgripper using Al-SiO2 bimorphs for precise micro-assembly. It demonstrates robust gripping capabilities and rapid response for micro-object manipulation in electronics.

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Area of Science:

  • Materials Science and Engineering
  • Micro- and Nano-engineering
  • Robotics and Automation

Background:

  • Microgrippers are crucial for micro- and nano-scale manipulation in fields like microelectronics and biomedical engineering.
  • Existing microgrippers require high precision, rapid response, reliability, and low power consumption for delicate object handling.

Purpose of the Study:

  • To develop and characterize an electrothermal actuated microgripper with Al-SiO2 bimorphs.
  • To evaluate the microgripper's performance in terms of deformability, response time, and gripping strength.

Main Methods:

  • Fabrication of a microgripper utilizing Al-SiO2 bimorphs, leveraging residual stresses for a naturally closed state.
  • Employing temperature control to actuate the microgripper between open and closed states via thermal expansion mismatch.
  • Experimental validation using polymethyl methacrylate (PMMA) microbeads and solder beads for handling and pick-and-place tasks.

Main Results:

  • The microgripper achieves over 100 degrees of bending at 5V with a response time under 10ms.
  • Demonstrated secure gripping of a 400μm PMMA microbead, withstanding 35g during vibration and over 1600g in impact tests.
  • Successfully completed pick-and-place tasks for 400μm solder beads on a silicon inductor chip.

Conclusions:

  • The developed electrothermal microgripper offers exceptional precision, rapid response, and robust gripping capabilities.
  • Its performance makes it highly suitable for micro-assembly and micromanipulation, particularly in electronic packaging applications.