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Halide Perovskite Photodiode Integrated CMOS Imager.

Wenya Song1, Jubin Kang1,2,3, Karim Elkhouly1,4

  • 1Interuniversity Microelectronics Center (imec), Leuven 3001, Belgium.

ACS Nano
|December 18, 2024
PubMed
Summary

High-resolution 2D and 3D imaging is achieved using perovskite photodiodes integrated with silicon read-out integrated circuits. This thin-film photodiode technology enables advanced depth sensing for applications like augmented reality.

Keywords:
CMOS ROICcarrier transit timecolor imaginghalide perovskiteimage sensorindirect time-of-flightphotodetectorphotodiode

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Area of Science:

  • Optoelectronics
  • Materials Science
  • Semiconductor Devices

Background:

  • Thin-film photodiodes (TFPDs) offer unique optoelectronic properties and monolithic processability, complementing traditional CMOS image sensors.
  • Halide perovskites exhibit excellent optoelectronic characteristics, including high absorption coefficients, long carrier diffusion lengths, and high carrier mobility, making them promising for photodiode applications.

Purpose of the Study:

  • To demonstrate high-resolution 2D and 3D imaging capabilities using perovskite photodetecting material integrated with a silicon read-out integrated circuit (ROIC).
  • To leverage the fast charge transport properties of perovskite photodiodes (PePDs) for advanced depth sensing applications.

Main Methods:

  • Integration of perovskite photodiode material onto a silicon ROIC to create a hybrid imaging sensor.
  • Implementation of a top-electrode controlled indirect time-of-flight (iToF) operation for 3D imaging, utilizing the fast switching capabilities of the TFPD pixel.

Main Results:

  • Achieved high-resolution 2D imaging through the integration of PePDs on Si ROIC.
  • Demonstrated depth sensing capabilities enabled by the fast carrier transport properties of the PePD.
  • Successfully implemented 3D imaging using the iToF method, showcasing the sensor's potential for spatial awareness.

Conclusions:

  • Perovskite photodiodes on Si ROIC represent a significant advancement for TFPD imaging platforms, combining excellent optoelectronic performance with CMOS technology.
  • This hybrid technology enables not only conventional 2D imaging but also advanced 3D sensing.
  • Potential applications include automotive systems, augmented reality (AR), and virtual reality (VR) due to enhanced imaging and depth perception capabilities.