Mechanisms of Heat Transfer II
Mechanisms of Heat Transfer I
Mechanisms of Heat Transfer
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Mechanism of heat transfer
Thermal expansion and Thermal stress: Problem Solving
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Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment
Published on: July 5, 2024
Yalong Zhang1, Jun Yang2, Xinjiang Zhang2
1College of Electrical and Information Engineering, Quzhou University, Quzhou, 324000, China. 37088@qzc.edu.cn.
A novel closed-box kernel function enables efficient and accurate numerical simulation of transient heat conduction. This method accelerates computations using Graphics Processing Units (GPUs) and reduces errors for practical engineering applications.
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