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Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
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A closed-box kernel function for numerical simulation of transient heat conduction.

Yalong Zhang1, Jun Yang2, Xinjiang Zhang2

  • 1College of Electrical and Information Engineering, Quzhou University, Quzhou, 324000, China. 37088@qzc.edu.cn.

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|December 29, 2024
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Summary

A novel closed-box kernel function enables efficient and accurate numerical simulation of transient heat conduction. This method accelerates computations using Graphics Processing Units (GPUs) and reduces errors for practical engineering applications.

Keywords:
Heat conduction equationKernel function.Numerical simulationPartial differential equationTransient heat conduction

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Area of Science:

  • Numerical analysis
  • Computational physics
  • Heat transfer

Background:

  • Accurate simulation of transient heat conduction is crucial for many engineering applications.
  • Existing numerical methods can be computationally intensive and time-consuming.

Purpose of the Study:

  • To develop a new, efficient, and accurate numerical method for simulating transient heat conduction.
  • To enable faster and more versatile simulations applicable to various materials and scenarios.

Main Methods:

  • Introduction of a novel 'closed-box kernel function' for transient heat conduction.
  • Single-point spatial temperature solution per time step, eliminating iterative processes.
  • Implementation of parallel computing with Graphics Processing Units (GPUs) for accelerated performance.

Main Results:

  • Achieved high accuracy with a relative error of 0.000072 after 24,700 iterations.
  • Demonstrated significant speedup, averaging 94.0712 times faster than Central Processing Unit (CPU) computations.
  • Verified correctness and accuracy through mathematical examples and a practical computational framework.

Conclusions:

  • The closed-box kernel function offers a versatile, accurate, and computationally efficient approach to transient heat conduction simulation.
  • The method's suitability for parallel computing with GPUs significantly enhances simulation speed.
  • The developed framework provides a practical tool for engineering applications requiring rapid and precise thermal analysis.