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Published on: May 13, 2020
High-Speed and Low-Energy Resistive Switching with Two-Dimensional Cobalt Phosphorus Trisulfide for Efficient
Yun Ji1, Baoshan Tang1, Jinyong Wang1
1Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117583, Singapore.
Two-dimensional cobalt phosphorus trisulfide (CoPS3) memristors offer fast, low-energy switching for neuromorphic computing. These materials enable high-accuracy artificial neural networks and scalable integration for future electronic circuits.
Area of Science:
- Materials Science
- Nanotechnology
- Computer Engineering
Background:
- Two-dimensional (2D) materials are promising for neuromorphic computing due to their electrical and mechanical properties.
- Implementing 2D memristors faces challenges in balancing low latency and low energy consumption.
Purpose of the Study:
- To demonstrate memristors based on 2D cobalt phosphorus trisulfide (CoPS3) for neuromorphic applications.
- To achieve high performance metrics including speed, energy efficiency, and reliability.
Main Methods:
- Fabrication of CoPS3 memristors.
- Electroforming process to create sulfur vacancies and conductive filaments.
- Characterization of switching speed, energy consumption, switching ratio, and voltage requirements.
- Evaluation of conductance modulation linearity and memory retention.
- Testing in artificial neural network models for handwritten digit recognition and image processing.
Main Results:
- CoPS3 memristors exhibit high switching speed (20 ns) and low switching energy (1.15 pJ).
- Achieved high switching ratio (>400) and low switching voltages (1.05 V set, -0.89 V reset).
- Demonstrated linear conductance modulation, long-term memory retention, and successful application in neural network models.
- Robust switching observed in solution-processed, large-scale CoPS3 films.
Conclusions:
- 2D CoPS3 materials show significant potential for energy-efficient neuromorphic computing circuits.
- The developed memristors offer a combination of rapid switching, low energy use, and scalability.
- Solution-processed CoPS3 films enable wafer-scale, low-temperature integration for advanced computing architectures.
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