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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

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Direct fabrication of lasers on silicon suggests solution to chip-production problem

Brian Corbett

    Nature
    |January 1, 2025
    PubMed
    Abstract

    No abstract available in PubMed .

    Keywords:
    EngineeringMaterials scienceOptics and photonics

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