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Xuesong Teng1, Shenglin Yu1, Cun Fang1
1School of Electronic and Information Engineering, Nanjing University of Information Science and Technology, Nanjing 210000, China.
This study optimizes Micro-Electro-Mechanical System (MEMS) infrared light source chips by simulating composite support film thickness to reduce stress and deformation. Advanced algorithms and packaging schemes ensure stability in harsh environments, improving sensor performance.
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