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Updated: Jun 2, 2025

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
Published on: May 2, 2016
Fang Wang1, Zhong-Ye Wang2, Yao-Rong Luo3
1Department of Polymer Science and Engineering, Key Laboratory of High-Performance Polymer Materials and Technology of MOE, State Key Laboratory of Analytical Chemistry for Life Science, School of Chemistry & Chemical Engineering, Nanjing University, Nanjing, China.
Researchers developed a novel porous polyamide material that doubles electrocaloric cooling efficiency for electronic devices. This advancement in thermal management is crucial for chip miniaturization and flexible electronics.
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