Modifying the antibacterial performance of Cu surfaces by topographic patterning in the micro- and nanometer scale

Antimicrobial surfaces are a promising approach to reduce the spread of pathogenic microorganisms in various critical environments. To achieve high antimicrobial functionality, it is essential to consider the material-specific bactericidal mode of action in conjunction with bacterial surface interactions. This study investigates the effect of altered contact conditions on the antimicrobial efficiency of Cu surfaces against Escherichia coli and Staphylococcus aureus. The fabrication of line-like periodic surface patterns in the scale range of single bacterial cells was achieved utilizing ultrashort pulsed direct laser interference patterning. These patterns create both favorable and unfavorable topographies for bacterial adhesion. The variation in bacteria/surface interaction is monitored in terms of strain-specific bactericidal efficiency and the role of corrosive forces driving quantitative Cu ion release. The investigation revealed that bacterial deactivation on Cu surfaces can be either enhanced or decreased by intentional topography modifications, independent of Cu ion emission, with strain-specific deviations in effective pattern scales observed. The results of this study indicate the potential of targeted topographic surface functionalization to optimize antimicrobial surface designs, enabling strain-specific decontamination strategies.